Job Details

Job Information

SIPI Architect for High-Speed SerDes
AWM-9579-SIPI Architect for High-Speed SerDes
5/2/2026
5/7/2026
Negotiable
Permanent

Other Information

www.apple.com
Austin, TX, 78703, USA
Austin
Texas
United States
78703

Job Description

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Role Number: 200634927-0157

Summary

In this position, you will work with the team that develops SoCs. In this high-impact role, you will define and own the end-to-end signal and power integrity strategy for cutting-edge high speed SerDes. You will be responsible for ensuring robust interconnect performance from silicon to system. This position requires deep expertise in leading-edge SerDes technologies (224G+), modern interconnect protocols, and system-level co-design.

Description

As the SIPI Architect, you will define and own the end-to-end signal and power integrity architecture for high-speed SerDes interconnects. You will guide technical direction across various teams, lead system-level trade-off analyses, and ensure design robustness through advanced modeling and validation.

Minimum Qualifications

  • BS and 20 +years of relevant industry experience.

Preferred Qualifications

  • MS or PhD in Electrical Engineering or a related field with 20+ years of relevant industry experience.

  • Deep expertise in system-level SIPI for high-speed SerDes (112G/224G and beyond).

  • Proven experience architecting solutions for high-performance interconnects using standards such as Ethernet, PCIe, UAL and CXL.

  • Expert in end-to-end channel modeling and link budget analysis, including statistical (e.g., COM) and time-domain simulation.

  • In depth understanding of SerDes TX/RX equalization techniques, clocking and power delivery trade-offs.

  • Experience leading cross-functional teams and driving technical consensus across silicon architecture, circuit design, packaging and system hardware groups.

  • Experience designing interconnects for large-scale systems such as those in data center or high-performance computing (HPC) environments.

  • Familiarity with emerging interconnect technologies, including co-packaged optics (CPO), and advanced packaging (e.g., 2.5D/3D integration).

  • Familiarity with system-level power integrity (PDN) and thermal co-design for large-scale, high-power ASICs.

Other Details

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