Job Details

Role Number: 200660017-0836

Summary

The Camera Hardware Engineering group is responsible for the design, development, and innovation of camera hardware across all Apple products. Our mission is to deliver superior camera hardware to enable best-in-class camera user experiences.

We’re seeking an engineer who’s excited to make an impact on our products and solve tomorrow’s challenges.

Description

The Camera EE Integration & Validation team makes cameras work flawlessly across Apple. We work with the earliest camera module prototypes through to MP ramping systems by defining test methodology to evaluate camera performance in isolation and in concert with other modules in system form factors. When issues arise our team debugs and resolves them, in collaboration with a wide range of cross functional partners, shaping the design of present and future cameras and systems.

As a member of this team, you'll build new validation and system integration test methodologies that surface EE issues early in the design cycle, directly influencing hardware decisions and guaranteeing a flawless user experience.

Minimum Qualifications

• BS degree in Electrical Engineering, Physics, or related field.

• Hands-on experience with EE test equipment such as oscilloscopes, high-speed probes, and function generators.

Preferred Qualifications

• 3+ years relevant work experience

• Experience with prototype hardware bring-up and debug

• Experience developing and deploying novel test methodologies

• Experience automating lab equipment and measurements with Python

• Experience with statistical analysis and visualization (JMP, Python, MATLAB, etc)

• Experience with high speed interfaces (e.g. MIPI, PCIe, DP, HDMI, USB), control interfaces (e.g. I2C, SPI, SPMI), and power circuits (e.g. linear regulator, SMPS)

• Understanding of CMOS image sensor principles of operation, image processing fundamentals, and image noise analysis

• Understanding of electrical noise and coupling mechanisms including conducted, radiated, and near-field

• Understanding of system integration grounding and shielding considerations for EMI, EMC, and ESD performance